During the shutdown of 2013–2014, for the enhancement of the current ATLAS Pixel Detector, a fourth layer (Insertable B Layer, IBL) is being built and will be installed between the innermost layer and a new beam pipe. A new generation of readout chip has been developed, and two different sensor designs, a rather conventional planar and a 3D design, have been bump bonded to the Front Ends. Additionally, new staves and module flex circuits have been developed. A production QA test bench was therefore established to test all production staves before integration with the new beam pipe. Quality assurance measurements under cleanroom conditions, including temperature and humidity control, are being performed on the individual components during the various production steps of the IBL, namely, connectivity tests, electrical tests and signal probing on individual parts and assembled subsystems. This paper discusses the pre-assembly QC procedures, the capabilities of the stave qualification setup, and recent results from stave testing.

Conference Title

TWEPP2013

Conference Country

Italy

Conference Date

Sept. 23, 2013 - Sept. 28, 2013

Conference Sponsor

INFN, CERN,

Additional Info

Conference Website