methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical
characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were
produced, and their curing behaviors were investigated. Using a molecular dynamics (MD) approach,
the impact of cyclotriphosphazene on the characteristics of DGEBA composites is thoroughly explored
in this paper. Results indicated that the glass transition temperatures (Tg) of DGEBA containing HGCP
had slightly decreased compared to DGEBA. With the addition of HGCP to DGEBA, epoxy resin
(DGEBA@HGCP@MDA) has a high thermal conductivity of 0.215284 W/m
K, with an increase of
116.04% more than pure DGEBA (0.185524 W/m
K). Moreover, the DGEBA@HGCP@MDA composite
has high mechanical strength with a specific Young’s modulus of 5.4902 GPa. In order to forecast
and analyze certain performances directly associated with the microstructure characteristics of the
various cross-linked resin systems and their composite materials, an MD simulation approach will be
quite valuable.

Title

Crystals

Publisher

MDPI

Publisher Country

Switzerland

Indexing

Scopus

Impact Factor

2.4

Publication Type

Prtinted only

Volume

--

Year

--

Pages

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