Two-phase closed thermosiphon system for cooling high heat flux electronic devices was constructed and tested on a lab scale. The performance of the thermosyphon system was investigated using R-134a as a working fluid. The effect of heat flux and the refrigerant pressure on the evaporator side heat transfer coefficient were investigated. It was found that the heat transfer coefficient increases by increasing the heat flux on the evaporator or by reducing the inside pressure. The effect of heat transfer mode of the condenser (natural or forced) also affected the overall heat transfer coefficient in the cycle. At the 200W heating load, the values of the heat transfer coefficients were 32 and 1.5 kW/m². ˚C, for natural and forced convection modes, respectively.
The temperature difference between the evaporator and the refrigerant saturation pressure was found to be dependent on heat flux and the pressure inside the system. At 40 W heating load, the heat transfer coefficient was calculated to be 500, 3000 and 7300 W/oC.m2 at 0.152, .135 and 0.117 reduced pressure, respectively. It can be concluded that such a thermosyphon system can be used to cool high heat flux devices. This can be done using an environmentally friendly refrigerant and without any need for power to force the convection at the condenser.

Title

JOURNAL OF ENGINEERING RESEARCH AND TECHNOLOGY

Publisher

Islamic University

Publisher Country

Palestine

Publication Type

Both (Printed and Online)

Volume

7

Year

2020

Pages

1-10