As advanced technology nodes are getting smaller and smaller, lithographic process is suspectible to dose and focus variations that would badly impact the lithographic yield. Process variations can be modeled as the area of XOR between two printed mask images obtained by two extreme conditions. This metric is called Process Variability band (PV-band) which can be reduced by proper placement of Sub Resolution Assisting Features (SRAFs) during Optical Proximity Correction (OPC). This paper proposes a PV-band reduction algorithm using SRAFs and polygons shifting.

عنوان المؤتمر

the 2014 IEICE Society Conference

دولة المؤتمر

اليابان

تاريخ المؤتمر

23 سبتمبر، 2014 - 25 سبتمبر، 2014

راعي المؤتمر

IEICE