Dynamic mechanical thermal analysis was used to investigate the thermal transitions and modulus/temperature behavior of thermoformable carrier films, and to relate the information obtained to carrier film behavior during the thermoforming process. In this study the glass transition temperatures (T _g) and the temperatures at which crystallization occurred during heating (T _c) of four thermoformable carrier films were measured by using a dynamic mechanical thermal analyzer (DMTA). These films are good candidates for the automotive process, which uses painted carrier films as moldable automotive coatings (MAC). The modulus/temperature behavior of the films was also observed over a wide temperature range, which included thermoforming temperatures. Although films of PETG and PCTG 5445, co-polyesters based on poly(1,4-cyclohexylene dimethylene terephthalate), are thermoformable, their T _g values, 92 and 99 °C, respectively, are not high enough to allow current paint systems (with bake temperature of 100–110 °C) to cure on the films without causing severe film deformation.